Description
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3 D - ABS / PLA printing (layer ≤ 0.25 mm), / cub. cm. |
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3 D - ABS / PLA printing (0.2 mm layer), . / Cu. cm |
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3 D - ABS / PLA printing (0.15 mm layer), . / Cu. cm |
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3 D - ABS / PLA printing (layer ≥0.1 mm), . / Cu. cm |
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3 D - MJM printing (layer 25 m r m), . / cu. cm |
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DMLS-technology of 3d printing from powdered metals, . / Cu. cm |
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Milling of light metals with a thickness of 1-2 mm, . / Rm. |
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Milling of light metals with a thickness of 3-4 mm, . / Rm. |
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Textolite milling with a thickness of 1-2 mm, . / Rm. |
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PCB milling with a thickness of 3-4 mm, . / Rm. |
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Milling of polymers with a thickness of 1-4 mm, . / Rm. |
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Milling of polymers with a thickness of 5-10 mm, . / Rm. |
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Production of 3 D - casting / layering, / man-hour |
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Milling of light metals with a thickness of > 4 mm, . / Rm. |
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PCB milling with a thickness of > 4 mm, . / Rm. |
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Milling of polymers, except PVC, with a thickness of > 4 mm, . / Rm. |
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PVC milling, thickness > 4 mm, . / Rm. |
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Manual soldering of a pin output with a diameter up to 1 mm of an element on a printed circuit board, . |
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Manual soldering pin pin with a diameter of 1 to 5 mm element on printed circuit board, . |
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Manual soldering of SMD componentoutput to one- and two-sided printed circuit board, . |
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Manual soldering of the BGA componentoutput to a single- and double-sided printed circuit board, . |
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Automatic soldering of SMD componentoutput to one- and two-sided printed circuit board, . |
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Automatic soldering of a pin output with a diameter up to 1 mm of an element on a printed circuit board, . |
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Washing of printed circuit boards from flux residues, ./sq.dm. |
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Additional services for the installation of eprinted circuit boards of complex shape and flex-rigid printed circuit boards , ./sq.m. |
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Moisture protection PCB varnish, . / Square dm. |
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Moisture protection of the PCB compound, ./sq.dm. |
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Setup and testing of the developed power supply systems, les / man-hour |
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Setup and testing of developed systems for generating low-frequency signals, / man-hour |
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Tuning and testing of the developed systems for generating high-frequency signals up to 10 MHz, / man-hour |
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Installation of a conductor with a diameter up to 1 mm on a printed circuit board, . |
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Installation of a conductor with a diameter up to 1 mm on a pin output / lamella / connector, . |
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Installation of a conductor with a diameter of 1 to 8 mm, . |
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Installation of ribbon cable with the number of contacts up to 10, . |
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Installation of ribbon cable with the number of contacts from 10 to 30, . |
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Setting the DIP - connector on a printed circuit board, . |
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Installing SMD - connector on the PCB, . |
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Testing the algorithms of the developed microprocessor systems for compliance with the technical task of the customer, les / man-hour |
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Assembly of a prototype / serial product, les / man-hour |
